EDIsecure® ILM-LS and ILM-DS Inline Lamination Modules
Fastest and most flexible lamination program for demanding applications
We
have developed the most flexible and fastest lamination program on the
market to respond to your growing requirements for durable and secure
tamper-resistant cards. With applying EDIsecure®
clear and secure laminates on the card, which includes patches with
chip cut-out, the surface will be protected against physical damage and
the card life extended.
The ILM-LS can be joined easily for Inline Lamination with the EDIsecure® XID
8300 Retransfer Printer, simply attach the unit with the appropriate
joining plate to the printer – that’s it. Communicating via infrared
interface, the lamination parameters for the various card materials are
controlled by the printer driver.
The laminator is also
disposable as ILM-DS for simultaneous dual side lamination. Equipped
with two lamination cartridges and separate temperature control of the
upper and lower heat roller, even different laminates can be applied to
the card at the same time.
Clear
or holographic patches in various thicknesses, patches with chip
cut-out for contact smart cards, as well as holographic overlays.
For more detailed product information such as specifications, features, supplies and options, please
.