EDIsecure® ILM Inline Lamination Module
High-speed lamination to extend the durability and security of your cards
Extend the life and security of your cards with the EDIsecure®
ILM Inline Lamination Module. The card surface will be protected
against physical damage and the card life will be extended by applying EDIsecure® clear and secure laminates on the card. Custom or generic holographic foils also help to protect the cards against tampering.
To maximize card security and durability, all EDIsecure® XID
93xx Retransfer Printers can be combined for inline lamination with the
ILM. With the optional external Flipper Unit the ILM can be upgraded to
double-side lamination or even to sandwich lamination of different
laminates.
Clear
or holographic patches in various thicknesses, patches with chip
cut-out for contact smart cards, as well as holographic overlays.
For more detailed product information such as specifications, features, supplies and options, please
